High-density Packaging and Module Manufacture

HMT offers access to a broad palette of technologies, selecting the best technology for each project. HMT has design capability for the entire list is installed and ready to go.

FlexTechnology

Technology: Flex technology special features are high reliability, high packing density and good ...

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Flip Chip Technology

Technology: Based on in-house bumped wafers or wafers with solder bump, picking-off from blue ...

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Hybrid Technology

Technology: Hybrid technology (Al2O3, known as alumina) special features are excellent reliability, ...

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IMS Technology

Technology: IMS technology special features are excellent high thermal conductivity, high ...

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PCB Technology

PCB technology special features are high reliability, high packing density and high mechanical ...

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Stud-Bump Technology

Technology: StudBump technology offers many technological advantages that make it the ideal choice ...

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High-density Packaging and Module Manufacture