Flip Chip Technology

Features:

  • Gold Bumping or Solder Bumping
  • Wafer size up to 8 inch
  • Pad size 90 μm typical
  • Pad pitch minimal 200μm
  • Gold bump dimensions Diameter: 50 - 70 μm, Height: 30 - 40 μm
  • Conductor pitch minimal 200 μm
  • Conductor pad minimal 100 x 100 μm
  • Contact material gold (flash gold for PCB)
  • Junction Gold bump: Conductive glue (Screen printed or) Solder bump: Solder
  • Die Attach Underfill technology
  • Substrate Ceramic, PCB, Flex, Film (only with solder bumping)
  • Chip on Chip Back to back or Chip to Chip mounting
  • Connectors DIL, SIL, BGA
  • Test 100%

Technology:

Based on in-house bumped wafers or wafers with solder bump, picking-off from blue foil, flipping optically controlled and mounting the die to the board, electrical test and under filling the gap between the die and the board: This leads together with SMD components to a high density packaging solution.

Development:

The development of modules and systems are realized completely inside HMT’s design center. Based on a close relationship between the customer, the production plant and the development engineer, the development covers all items of concept analysis, pre-study, project definition, design and industrialization under the responsibility of HMT microelectronic Ltd.

Production:

The production and test of such developed modules or systems is done inside HiDensity group under the full responsibility of Flip Chip TechnologyHMT microelectronic Ltd. For each product a specific production and test procedure is developed and results of each production lot are included in the deliverables to the customer.

Excample of a Ball Grid Array (BGA) sub-modul

  • Chip Back to Back
  • Chip on substrate in flip chip technology (gold bump)
  • Further chip in wire bond technology
  • Ceramic substrate with via
  • Sub-module’s contact in BGA technology
  • Coating on dice for protection
  • Sub-module is mountable as SMD component