High-density Packaging and Module Manufacture
HMT offers access to a broad palette of technologies, selecting the best technology for each project. HMT has design capability for the entire list is installed and ready to go.
FlexTechnology
Technology: Flex technology special features are high reliability, high packing density and good ...
Flip Chip Technology
Technology: Based on in-house bumped wafers or wafers with solder bump, picking-off from blue foil, ...
Hybrid Technology
Technology: Hybrid technology (Al2O3, known as alumina) special features are excellent reliability, ...
IMS Technology
Technology: IMS technology special features are excellent high thermal conductivity, high ...
PCB Technology
PCB technology special features are high reliability, high packing density and high mechanical ...
Stud-Bump Technology
Technology: StudBump technology offers many technological advantages that make it the ideal choice ...
