1. Foundry Partners

HMT works together with key European, US foundry and Korean partners offering automotive-qualified technologies, long-term technology availability and quality assurance agreements.

For our demanding products, close cooperation with our foundry partners is essential. We work together as official foundry design partners or as subcontractors to promote close technical collaboration and ensure optimum technology access.

ASICs generally form a critical element of a customer's product and security stock agreements are available.

As volumes grow, second sourcing and a lean supply chain become increasingly important. HMT provides flexible business models together with our foundries, allowing assembly and test activities to be transferred to the foundry for higher-volume production or enhanced supply security. This is achieved while retaining responsibility for product quality within HMT, and all products are statistically monitored to ensure design and production test stability.

There are medical and aeronautical products produced in high volumes, but typically production volumes remain moderate. As a specialist ASIC partner, HMT can efficiently support these requirements throughout manufacture and test.

1.1 STMicroelectronics

For more than 30 years, HMT microelectronic AG has maintained a close and successful partnership with STMicroelectronics, supporting the development and production of highly integrated mixed-signal ASICs for industrial, automotive, medical and sensor applications.

ST’s broad portfolio of CMOS, BCD (Bipolar-CMOS-DMOS) and specialised process technologies provides an excellent foundation for the implementation of complex ASIC solutions that combine precision analogue circuitry, robust digital processing, embedded non-volatile memory, power management and medium-voltage functions on a single chip.

Over the years, HMT has successfully developed numerous ASICs based on ST technologies, ranging from sensor interfaces and industrial communication ICs to motor control, power management and application-specific mixed-signal solutions. This long-standing collaboration provides our customers with access to proven manufacturing technologies, high-volume production capabilities, long-term technology availability and automotive-qualified process options.

In addition to conventional bulk CMOS and BCD platforms, selected Silicon-on-Insulator (SOI) technologies are available for applications requiring enhanced isolation, improved robustness or specialised high-voltage performance.

By combining ST’s manufacturing expertise with HMT’s nearly 50 years of mixed-signal ASIC design experience, customers benefit from a reliable path from concept to volume production, supported by strong technical collaboration throughout the entire product lifecycle.

1.2 ON Semiconductor

HMT microelectronic AG utilises a range of onsemi mixed-signal, high-voltage and BCD process technologies for the development of advanced ASIC solutions targeting industrial, automotive and sensor applications.

The onsemi technology portfolio includes mature high-voltage platforms as well as modern mixed-signal processes such as ONC18gen2 and BCD65 (Treo™), enabling the integration of precision analogue circuitry, digital logic, communication interfaces and power management functions on a single chip.

These technologies provide access to automotive-qualified manufacturing flows, comprehensive IP libraries and proven reliability, making them well suited for applications requiring long operational lifetimes and high robustness.

Features such as deep trench isolation, advanced high-voltage devices and specialised analogue building blocks support the implementation of compact, high-performance mixed-signal ASICs with excellent electrical isolation and noise performance.

Together, onsemi's technology portfolio and HMT's nearly 50 years of mixed-signal ASIC design experience provide customers with a strong foundation for successful product development and long-term production support.

1.3 X-FAB

HMT microelectronic AG works with X-FAB for selected mixed-signal, analogue and high-voltage ASIC developments requiring specialised process technologies and long-term product availability.

X-FAB is a leading specialty foundry focused on automotive, industrial and medical applications. Its portfolio includes CMOS, SOI, MEMS and high-voltage technologies, providing a flexible platform for the implementation of robust mixed-signal ASICs.

Particular strengths include high-voltage integration, analogue performance and specialised process options such as BCD-on-SOI, which offer enhanced isolation, low parasitic effects and strong latch-up immunity. These features make X-FAB technologies particularly well suited for demanding industrial and safety-critical applications.

Through this collaboration, HMT can provide customers with access to specialised semiconductor technologies that complement our broader foundry ecosystem and support the development of reliable long-lifecycle ASIC products.

1.4 DB HiTek

DB HiTek is a leading specialty foundry focused on mixed-signal, analogue and power semiconductor technologies. As a recent addition to HMT's foundry portfolio, DB HiTek expands the range of technology options available for future industrial, automotive and power management ASIC developments.

The technology portfolio includes CMOS, BCD and high-voltage processes that enable the integration of precision analogue circuitry, digital logic and power devices within a single ASIC. These platforms are well suited for applications requiring robust mixed-signal performance, efficient power management and long product lifetimes.

Through collaboration with DB HiTek, HMT continues to expand the range of technology options available to customers, providing additional flexibility for future ASIC developments and access to competitive manufacturing solutions.

4. Layout Partners

HMT works with specialised IC layout partners to complement our in-house design capabilities and support efficient execution of complex ASIC developments. These partnerships provide additional capacity, specialised expertise and flexibility, enabling us to scale resources according to project requirements while maintaining HMT's quality standards and design methodologies.

4.1 4ASICS

4ASICS is HMT's primary external layout partner and has supported numerous successful ASIC developments across industrial, automotive and sensor applications.

The company specialises in custom IC layout, physical verification, design rule checking (DRC), layout-versus-schematic verification (LVS) and tape-out preparation for advanced mixed-signal, analogue and high-voltage semiconductor technologies.

Through close cooperation and established development workflows, 4ASICS seamlessly integrates into HMT's ASIC development process, providing additional layout capacity while ensuring the highest standards of quality, performance and manufacturability.

This long-standing collaboration enables HMT to efficiently execute complex ASIC projects while maintaining predictable schedules and consistent design quality across multiple technology platforms.

2. Assembly & Test Partners

HMT collaborates with leading outsourced semiconductor assembly and test (OSAT) providers to support the industrialisation and volume production of ASIC products. These partnerships provide access to a wide range of package technologies, test solutions and global manufacturing capabilities, ensuring reliable supply chains and scalable production for industrial, automotive, medical and consumer applications.

2.1 ASE Technology Holding

ASE Technology Holding is one of the world's largest providers of semiconductor assembly and test services. Through collaboration with ASE, HMT gains access to a comprehensive portfolio of package technologies and high-volume manufacturing capabilities for mixed-signal, analogue and power semiconductor products.

ASE supports a wide range of package options, including QFN, TQFP, SOP, wafer-level packaging, flip-chip and advanced system-in-package solutions. Their global manufacturing footprint and extensive quality systems make them an ideal partner for demanding industrial and automotive applications.

By leveraging ASE's advanced assembly and test capabilities, HMT can support customers from prototype development through to high-volume production while maintaining robust quality and supply chain management.

2.2 Cirtek

Cirtek provides semiconductor assembly and test services for a broad range of mixed-signal, analogue and power semiconductor products. The company offers flexible manufacturing solutions ranging from prototype quantities to high-volume production.

Its packaging portfolio includes standard leadframe packages, QFN solutions, bare die delivery, wafer processing and specialised assembly services, supporting the diverse requirements of HMT's customer base.

The partnership with Cirtek complements HMT's broader manufacturing ecosystem by providing additional sourcing flexibility, production capacity and long-term supply support for ASIC products.

3. Microelectronic Manufacturing Service Partners

In addition to ASIC design and industrialisation, HMT collaborates with specialised manufacturing partners that provide advanced microelectronic assembly, packaging and test services. These partnerships enable the delivery of complete solutions ranging from bare die and packaged ASICs to highly integrated electronic modules for demanding industrial, medical and automotive applications.

3.1 MW.FEP

MW.FEP specialises in advanced microelectronic packaging and assembly technologies for high-reliability applications. Their expertise includes chip-on-board assembly, wire bonding, encapsulation and customised packaging solutions, supporting the implementation of compact and highly integrated electronic systems.

3.2 Hybrid SA

Based in Neuchâtel, Switzerland, Hybrid SA provides in-group microelectronic manufacturing services, including the production and testing of miniature electronic modules for medical, industrial and scientific applications. Their capabilities cover a broad range of assembly technologies and substrate types, enabling highly customised and miniaturised solutions.

3.3 Grossenbacher Systeme AG

Grossenbacher Systeme AG, based in St. Gallen, Switzerland, provides certified electronic manufacturing services ranging from prototype assembly to series production and testing. With extensive experience in medical and industrial electronics, Grossenbacher supports the reliable industrialisation of high-quality electronic products.